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Laser Soldering M/C

Laser Soldering M/C

Product overview

• It is non-contact type and laser beam takes aim to the target accurately
• Minimization of effects to peripheral parts by minimized heat-affected zone
• Micro structure formation of micro particle solder by rapid heating and cooling of solder
• It is suitable when heat-sensitive parts are existed near to solder object part

Laser Soldering Application
• PCB of Electric/Electronics, Semiconductor, Automobile, etc
• RF/HP Board, CPU Connector, Sensors

Product details